Plasma-Therm Rolls Out Redesigned Heatpulse Rapid Thermal Processing Platform to Meet Evolving Market Requirements

SEMICON West, San Francisco, Calif., July 12, 2022—Plasma-Therm, a leading manufacturer of
plasma-process equipment for the semiconductor and compound semiconductor industries, today
announced it has redesigned its flagship Heatpulse Rapid Thermal Processing (RTP) platform. The
move was driven by three key factors: an increase in market demand for power devices, other specialty
markets and ≤200mm silicon fabs; the need to establish a new supply chain to enable faster time to
market and bring customers readily available spare parts for their systems; and the company’s
commitment to deliver improved system reliability and performance to customers. Top global
chipmakers have already placed multi-tool orders for the newly designed Heatpulse RTP platform,
which is fully compatible with the legacy AG Heatpulse 8108 and 8800 systems and existing
processes.
Representing the first of several phases in Plasma-Therm’s planned technology roadmap for Heatpulse
RTP, the new platform includes greater flexibility to accommodate multiple wafer sizes, upgraded
robotics, and a control system backed by Cortex, Plasma-Therm’s industry leading software. By using
readily available components instead of specialized custom parts to maintain their equipment,
customers can mitigate supply chain and replacement parts challenges to optimize production yields
and capacity with maximize uptime during high-volume manufacturing. Additionally, the new easily
implemented Heatpulse RTP wafer size conversion kits eliminate the complicated, time-consuming
system hardware changes.
“With more than 450 systems shipped, the legacy AG Heatpulse 8108 and 8800 models have run
reliably for over 30 years, serving a variety of markets and applications,” said Jim Garstka, vice
president of sales and business development, Plasma-Therm. “Our customers are eager to upgrade to
the new and improved Heatpulse systems to keep their existing processes running smoothly in
production both now as well as into the next decade and beyond. Receiving multiple purchases from
some of the top chipmakers in Asia, Europe, and the U.S. reaffirms our position as a top supplier of
wafer etch and clean equipment in the semiconductor industry.”
Like its predecessor Heatpulse 8800 and 8108 models, the new Plasma-Therm Heatpulse RTP
platform can process substrates up to 200mm in diameter and can handle a diverse range of materials.
This includes traditional CMOS silicon as well as compound semiconductors, such as gallium arsenide
(GaAs), gallium nitride (GaN) and silicon carbide (SiC).
The Heatpulse technology features are designed to address a multitude of semiconductor process
steps, including post-implant annealing, oxide and nitride film growth, reflow, and formation of silicides,
salicides, metal alloys, as well as ohmic contact formation. The Heatpulse RTP is available in either a
single-oven or a new dual-oven configuration unique to the redesigned platform, and features a multizoned,
independently controlled temperature capability.
Plasma-Therm at SEMICON West 2022
To learn more about our new Heatpulse RTP platform and other offerings, you can schedule an inperson
meeting with one of our experts at SEMICON West, or visit us in the Kiterocket Lounge, located
on the rooftop of Moscone North, during SEMICON West in San Francisco, July 11-14, 2022.
About Plasma-Therm
Plasma-Therm is a global manufacturer of advanced plasma processing equipment. Its tools and
processes are used to support manufacturing needs in etch, deposition, material modification, and
plasma dicing technologies. The company serves the semiconductor and compound semiconductor
industries in developing solutions for the wireless, power device, MEMS, photonics, advanced
packaging, and data storage markets. With locations in North America, Europe and Asia-Pacific,
Plasma-Therm meets the diverse needs of its customers with exceptional customer service. To learn
more visit www.plasmatherm.com.

###